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The basic principle of SMT patch processing is to use surface mount technology to mount electronic components onto printed circuit boards and fix the components through thermal reflow soldering. The following are several key steps of SMT patch processing to explain its basic principle:

FCT testing (functional testing) and ICT testing (in-line circuit testing) are both essential components of PCBA (Printed Circuit Board Assembly) testing, and they play a critical role in the circuit board production process. Although both aim to ensure product quality, there are distinct differences in their testing methods, purposes, and application scenarios.

● Chinese mainland's PCB output value in 2023 is better than the global average with a decline of 9%, due to the low proportion of carrier boards and the growth of automotive applications. ● In South Korea, which has a high proportion of carrier boards, the superimposed industry is concentrated in consumer electronic memory applications, and its PCB output value has declined by more than 20%.

The December 2024 ECST survey of supply chain participants found that concerns about December sales eased compared to the November outlook. The November survey predicts an overall index score of 94.4, which is the highest level since December 2023. The actual results of the December survey showed that concerns eased, with an actual score of 98.4, a significant decrease from November but unchanged from previous months. Passive components are a category that scored over 100 in December, with a sco