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Detailed content

  • Maximum size: 570*650mm

  • Maximum thickness: 10mm

  • Thickness tolerance: ±5%

  • Number of stacking holes: 3

  • Maximum number of presses: 4 (including HDI)

  • Flatness (DUT area): 50 μm

  • Signal rate: 112G PAM4/65G NRZ

  • Maximum number of layers: >100 layers

  • BGA DUT Pitch(最小):0.35mm


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